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Palabras clave – provistas por la editorial

electromagnetic bandgap (EBG); dual perforation (DP); parallel-plate noise; power delivery network (PDN); printed circuit board (PCB); meander split; power/ground plane; crosstalk; signal integrity; equivalent circuit; capacitive and magnetic coupling; hall-effect current sensors; commercial current sensor; electromagnetic compatibility (EMC); electromagnetic interference (EMI); direct power injection (DPI) test; transverse-electromagnetic (TEM) test; bulk current injection (BCI) test; Spread Spectrum; DC–DC power converters; digital communications; channel capacity; resonant coupling; Electromagnetic Interferences; Amplifiers; CMOS integrated circuits; susceptibility of the output pin; electromagnetic compatibility; power electronics EMC; EMI mitigation techniques; EMI filter design and optimization; common mode noise; EMI modeling; Fourier series; impedance balancing; resonant frequency; battery management system (BMS); Li-ion battery pack; electric vehicles (EVs); hybrid electric vehicles (HEVs); IC-level EMC; susceptibility to electromagnetic interference (EMI); direct power injection (DPI); anechoic chamber; polyaniline; gelatin; composite; microwave absorption; dielectric permittivity; electrical conductivity; shielding effectiveness; biochar; eco-friendly material; cementitious composites; waveguides; electromagnetic interference (EMI) suppressors; sleeve ferrite cores; cable filtering; nanocrystalline (NC); split-core; snap ferrite; gap; DC currents; relative permeability; impedance; conducted emissions; Discrete Wavelet Transform; electromagnetic interference; Empirical Mode Decomposition; harmonics; Switched-Mode Power Supplies; transients; Wavelet Packet Transform