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Palabras clave – provistas por la editorial

multi-beam micromachining; beam splitting; invar; shadow masks; OLED; nanosecond laser; direct laser interference patterning; design of experiments; central composite design; morphological filtering; surface texture homogeneity; micro structuring; bearing steel; dual laser beam processing; excited state absorption; semiconducting thin films; stimulated emission depletion; femtosecond laser; silicon; amorphization; crystallization; spectroscopic imaging ellipsometry; transmission electron microscopy; atomic force microscopy; laser ablation; ultrafast; re-deposition; fs-laser writing; waveguides; element redistribution; Soret effect; diffusion competition effects; ultra-short pulses; double pulses; burst processing; MHz bursts; GHz bursts; X-ray emission; micromachining; dose rate; X-ray spectrum; ultrafast laser; laser; ultrashort pulse; plasma; X-ray; Bremsstrahlung; resonance absorption; burst; bi-burst; beam shaping; squared top-hat; fs-laser; laser surface structuring; laser-induced periodic surface structures; micro-channels; glass; ultrafast laser processing; Bessel beam; X-ray emission hazards; ultrashort pulsed laser; radiation protection; industrial applications; protection housing; ambient dose rate; pulsed laser; laser micromachining; mechanical shutter; solenoid shutter; electro-optic modulator shutter; opening time; lifetime; X-ray energies; X-ray dose rate; laser printing; laser-induced forward transfer (LIFT); digital manufacturing; additive manufacturing; printing of materials; n/a