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multi-beam micromachning; functionalization; tempered glass; gloss reduction; anti-reflection; SOI substrate; cavity-SOI; cavity-BOX; patterned BOX; buried hard-etch mask; flex to rigid (F2R); MEMS; miniaturization; DBS; foldable devices; laser polishing; different surface morphologies; melt hydrodynamics; numerical simulation; alloy wire; processing rate; annealing; strength; elongation; resistivity; tension; silicon nanowires; nanoparticles; Bosch process; hydrophobicity; very high frequency (VHF); multi-split electrode; low-temperature polysilicon (LTPS); precision processing; electroforming; metal structures; deformation; electrical discharge coating; microhardness; material deposition rate; TOPSIS; Fused Deposition Modeling (FDM); acrylonitrile butadiene styrene (ABS); polyamide (Nylon); fatigue; ANCOVA regression analysis; Taguchi analysis; parametric study; numerical study; bonding wire; manufacturability; reliability; general comparison; development trends; n/a