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Palabras clave – provistas por la editorial

deployable structure; compliant mechanism; bistable mechanism; programmable behaviour; 5G; mmWave; SIW; hybrid feeding; SIC; wide bandwidth; ECC; stable high gain; isolation; MEG; DIG; SAR; SSL; metamaterials (MMTs); DRAs; Fano resonance; SPPs; U-shaped ring resonator; sensor; metal-insulator-metal; micropump; magnetorheological; MRE; magneto-solid-fluid interaction; additive manufacturing; microscale; design; materials; processes; applications; atomic layer deposition; sacrificial templates; 3D nanostructures; EDM; SiCp/Al; recast layer; residual stress; solidification; deep-narrow groove; GH4169 alloy; electrochemical milling; wedged end face; micro automotive electronic pump; computational fluid dynamics; numerical simulation; experimental techniques; cavitation; thermodynamic effects; InP; SiC; flip-chip bonding; millimeter wave; heterogeneous integration; linear guide; decoupling mechanism; finite element analysis; micro-milling; wear; tool failure; coating; substrate; delamination; Fresnel zone plate; annular structure; femtosecond laser machining; concentric double-ring beams; MEMs; burn-in; quality; reliability; warranty; maintenance; optimization; degradation; material properties; test structures; stress gradients; thin-film material properties; micro- and nano-systems (MNS) fabrication and manufacturing; microstructures; nanostructures; mechanics; analysis