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Palabras clave – provistas por la editorial

3D-IC (three-dimensional integrated circuit); electromagnetic interference; near field measurement; SAC305; BGA; low temperature; fracture failure; factorial design of experiment; genetic algorithm optimization; return loss; multiple-input multiple-output (MIMO); single event effects; linear energy transfer; Monte Carlo simulation; radiation hardness; pressureless sintered micron silver joints; deep space environment; extreme thermal shocks; reconstruction; simulation; elastic mechanical properties; state of health; remaining useful life; electrochemistry based electrical model; semi-empirical capacity fading model; useful life distribution; quality and reliability assurance; single event effect; microdosimetry; lineal energy; deconvolution; gamma process; lifetime; measurement system analysis; reliability estimation; GaN; operational amplifier; proton therapy; prompt gamma imaging; 3D X-ray; bias temperature-humidity reliability test; conductive anodic filament (CAF); de-penalization; finite element analysis; n/a