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Micro-machining is an advanced manufacturing technique of growing importance, and adoption of micro-machining using electrochemical discharges (Micro-ECDM) has increased steadily in recent years. Among new developments is the interest of industry in Micro-ECDM. However, the potential of the technology is not being fully utilized and there is no comprehensive reference book available today covering it. Micromachining Using Electrochemical Discharge Phenomenon, Second Edition fills this gap. It is unique in its detailed coverage of all aspects of the Micro-ECDM process, as well as Spark Assisted Chemical Engraving (SACE). As such, it covers technologies such as chemical etching, micro-drilling, and other material removal mechanisms, high aspect ratio machining, design and construction of the machining apparatus, and a wide range of applications. The new edition compares Micro-ECDM and SACE with other micromachining technologies such as laser machining and traditional EDM. ECDM is used for machining of electrically non-conductive materials. Micro-ECDM/SACE is mainly applied to glass and the book focuses on glass, but the authors also present new results on other materials such as ceramics. In addition, techniques to modify material properties for the machining process are explained. The authors discuss machining strategies including the latest developments in micro-texturing of glass micro-channels and reports on developments in controlling and analysis aspects of machining. This book is a unique reference for engineers and industrial researchers involved in development, design and use of micromachining, chemical micro-drilling or chemical engraving techniques and equipment.

• Only all-encompassing reference coving Micro-ECDM and SACE available on the market
• Covers a wide range of applications, including applications in the MEMS industry and the Medical Devices and Medical Diagnostics industries
• New edition includes expanded sections on comparing Micro-ECDM/SACE with other micromachining technologies

In this book the authors focus on the description of the physical nature of cleavage fracture to offer scientists, engineers and students a comprehensive physical model which vividly describes the cleavage microcracking processes operating on the local (microscopic) scale ahead of a defect. The descriptions of the critical event and the criteria for cleavage fracture will instruct readers in how to control the cleavage processes and optimize microstructure to improve fracture toughness of metallic materials.

• Physical (mechanical) processes of cleavage fracture operating on the local (microscopic) scale, with the focus on the crack nucleation and crack propagation across the particle/grain and grain/grain boundaries
• Critical event, i.e., the stage of greatest difficulty in forming the microcrack, which controls the cleavage fracture
• Criteria triggering the cleavage microcracking with incorporation of the actions of macroscopic loading environment into the physical model
• Effects of microstructure on the cleavage fracture, including the effects of grain size, second phase particles and boundary
• Comprehensive description of the brittle fracture emerging in TiAl alloys and TiNi memory alloys