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Palabras clave – provistas por la editorial

localized meshless collocation method; virtual boundary element; fundamental solution; Laplace equations; Helmholtz equations; thermo-elastic structure; topology optimization; reliability analysis; stress constraint; radial basis function; the shape parameter; multiquadric; inverse multiquadric; Gaussian; elastic-plastic problems; incremental theory; Smoothed Finite Element Method (S-FEM); Julia language; parallel programming; nonlinear elliptic equation; doubly connected domain; inverse problems; two-parameter homogenization functions; Brazilian disc test; numerical simulation; crack evolution; failure mode; indirect tensile strength; topology optimisation; piezoelectric actuator; shell; finite element method; symmetric tridiagonal matrix; eigenvalue solver; matrix division; parallel algorithm; machine learning; extrinsic; embedding; intrinsic; surfaces; Laplace–Beltrami operator; meshfree numerical technique; free vibration; integration error; numerical integration; eigenvector solver; clustered eigenpairs; orthogonalization; general Q iteration; triangulations; shortest edge; triangle shape; high-order enrichment functions; numerical methods; numerical dispersion; transient analysis; wave propagation; Bernstein–Bézier coefficients; quasi-interpolation; type-1 triangulation; Clough–Tocher split; multi-dimensional fractional equations; multi-term fractional equations; meshless method; collocation method; analytic representation; numerical analysis; structure optimization; parametric optimization; GST; chromium; SiO2; Photovoltaic applications; co-simulation; defect analysis; error bounds; variable step-size; singular boundary method; Kansa’s method; heterogeneous media; acoustic wave; soil–rock mixture; lattice Boltzmann method; size effect; permeability; global–local; non-intrusive; computational simulation; crack growth; frame elements; 3D solids; coupling