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Palabras clave – provistas por la editorial

encapsulation; n/a; NEM memory switch; magnetotransistor; gas sensor; nano-system array; metal oxide (MOX) sensor; capacitive pressure sensor; real-time temperature compensation loop; mechanical relays; single-crystal silicon (SC-Si); MEMS relays; MEMS; oscillator; micro-electro-mechanical system (MEMS); uncooled IR-bolometer; microelectromechanical systems; microbolometer; programmable sustaining amplifier; micro sensor; CMOS-MEMS; pierce oscillator; MEMS resonators; micro/nanoelectromechanical systems (MEMS/NEMS); resonator; microhotplate; NEMS; application-specific integrated circuit (ASIC); MEMS modelling; magnetic field; chopper instrumentation amplifier; microresonators; interface circuit; Hall effect; thermal detector; temperature sensor; infrared sensor; CMOS–NEMS; CMOS; atomic force microscope; MEMS switches; stent; micro-electro-mechanical systems (MEMS) sensors; nano resonator; silicon-on-insulator (SOI); MEMS-ASIC integration; Sigma-Delta; MEMS characterization; high-Q capacitive accelerometer; mass sensors; M3D