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polyhedral oligomeric silsesquioxanes; nanocomposites; POSS; polystyrene; thermal behavior; SEM analysis; soy flour; soy protein isolate; insoluble carbohydrates; periodate oxidation; aldehydes generation; condensation reactions; soy adhesives; biodegradable polymers; rheological properties; irrigation pipes; soil burial test; polyesters; Bio-Flex®; Mater-Bi®; polymer degradation; photo-oxidation; pectin; alginate; biocomposites; food packaging; degradable films; ionic liquids; 3D printing; digital light processing; CO2 capture; furanic polymer; spectroscopy; solid-state 13C-NMR; FTIR; Raman; linear structure; ring opening; γ-lactone; Diels-Alder; SAS coprecipitation; controlled drug delivery systems; microparticles; eudragit; supercritical carbon dioxide; dental materials; composite resin; layered double hydroxide; calcium bentonite; antibiofilm activity; injection molding; structure/properties relationship; cavity temperature fast modulation; chitosan; cyclodextrin; macromolecular complex; dalargin; enkephalin; chymotrypsin; NMR; oral peptide delivery; peptide stability; cold-cure; epoxy resins; organic-inorganic hybrids; sol-gel; layered double hydroxides; carbon nanotubes; electrical properties; polyphenols; flavonoids; furanics; sulphur; bio-polymers; pentane; heating value; mulch films; Ecovio®; polylactide; poly(butyleneadipate-co-butyleneterephtalate); polyethylene; polymer melt; primary and secondary relaxations; Johari-Goldstein relaxation; bond reorientation; vibrational dynamics; molecular-dynamics simulations; UV-LED curing; epoxy-acrylate resin; biochar; multiwalled carbon nanotubes; composites; reduced graphene oxide; polyketone functionalization; electrically-conductive nanocomposites; UHMWPE; wear tests; bio-activity; history; cyclodextrin nanosponge; crosslinked polymer; diclofenac; mefenamic acid; molecular imprinting; delayed addition; binding isotherm; binding selectivity; imprinting factor; polymers; life cycle assessment; polymeric materials; sustainability; plastic; LCA; additive manufacturing; LCD printing; epoxy; polymer blends; thermomechanical properties; n/a