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Palabras clave – provistas por la editorial

fused silica; small-scale damage; magnetorheological removing method; combined repairing process; evolution law; diamond grinding; single crystal silicon; subsurface damage; crystal orientation; spherical shell; thin-walled part; wall-thickness; benchmark coincidence; data processing; ultra-precision machining; computer-controlled optical surfacing; dwell time algorithm; removal function; elementary approximation; atmospheric pressure plasma jet; continuous phase plate; surface topography; high accuracy and efficiency; polar microstructures; optimization; machining parameters; cutting strategy; flexible grinding; shear thickening fluid; cluster effect; high-shear low-pressure; aluminum; ion beam sputtering; morphology evolution; molecular dynamics; electrochemical discharge machining (ECDM); material removal rate (MRR); electrode wear ratio (EWR); overcut (OC); electrical properties; tool material; diamond tool; single-point diamond turning; lubricant; ferrous metal; electrorheological polishing; polishing tool; roughness; integrated electrode; Nano-ZrO2 ceramics; ultra-precision grinding; surface residual material; surface quality; three-dimensional surface roughness; reversal method; eccentricity; piezoelectric actuator; flange; dynamic modeling; surface characterization; cutting forces; tool servo diamond cutting; data-dependent systems; surface topography variation; microstructured surfaces; microlens array; three-dimensional elliptical vibration cutting; piezoelectric hysteresis; Bouc–Wen model; flower pollination algorithm; dynamic switching probability strategy; parameter identification; atom probe tomography (APT); single-wedge; lift-out; focused ion beam (FIB); Al/Ni multilayers; vibration-assisted electrochemical machining (ECM); blisk; narrow channel; high aspect ratio; multi-physics coupling simulation; machining stability; n/a