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Título de Acceso Abierto
Microstructure and Mechanical Properties of Structural Metals and Alloys
Resumen/Descripción – provisto por la editorial
No disponible.
Palabras clave – provistas por la editorial
n/a; microstructure; high-pressure torsion; electron backscattered diffraction; grain boundary engineering; strengthening mechanism; precipitation; recrystallization; bimodal ferrite steel; transmission electron microscopy (TEM); hot compression; metal–matrix composite; columnar grain; shape memory alloy; hardness; structural steel plate; dynamic recovery; nonmetallic inclusions; SEM; Cu-Al-Mn; ferritic steel; strain rate; strengthening; elastocaloric effect; Mg–Sm–Zn–Zr; dynamic recrystallization; growth rate; corrosion resistance; lead-free solder; high-Mn TWIP steel; Sn-8.0Sb-3.0Ag; SDSS; measuring temperature; texture; martensitic steels; dynamic precipitation; nanoindentation; Al-Fe-Si-Zr system; low-temperature; orientation relationship; M23C6; PWHT; grain refinement; force peak; aging; cycle time; amorphization; Al metal matrix composites; aluminum alloys; in situ tensile testing; microstructure evolution; Cu-Cr-Zr; irradiation; EBSD; welded rotor; ?-phase; high-entropy alloys; creep; martensitic expansion; super duplex stainless steel; mechanical properties; high-Mn steel; ion irradiation; austenitic 304 stainless steels; impact toughness; cold rolling; ultrafine-grained microstructure; press hardening; mechanical property; recovery; annealing; deformation twinning; post-weld heat treatment; rare earth control; abnormal grain growth; electron microscopy; sub-merged arc welding; M6C; RAFM steels; microstructure analysis; electrical resistivity; twinning; Sb solder; work hardening; microhardness; hot stamping; weld metal; electrical conductivity; solder microstructure; annealing twins
Disponibilidad
| Institución detectada | Año de publicación | Navegá | Descargá | Solicitá |
|---|---|---|---|---|
| No requiere | Directory of Open access Books |
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Información
Tipo de recurso:
libros
ISBN electrónico
978-3-03897-506-9
País de edición
Suiza