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Palabras clave – provistas por la editorial

thermal interface material; thermal aging; modeling; LED compact thermal models; niobium pentoxide; model-order reduction; ferromagnetic cores; LED digital twin; Cauer RC ladder; in-situ characterization; electronic packages; time domain thermoreflectance; multi-domain compact model; power LEDs; DC–DC converters; structure function; boundary condition independent; electric aircraft; multi-LED; modelling; light emitting diodes; thin film; JEDEC metrics; tool agnostic; power losses; switching; dynamic thermal compact model; thermal transient testing; reliability; thermal transient analysis; thermal simulation; non-destructive testing; IGBT; carbon nanotubes; compact thermal model; power semiconductor devices; SPICE; phosphor light conversion; thermal management; LED luminaire design; design flow; thermal characterization; motor cooling; thermal phenomena; silicone dome; LED; secondary heat path; multi-domain modelling; heating and optical power; transient analysis; thermal testability; thermal conductivity; multiple heat source