Catálogo de publicaciones - libros
Solder Joint Technology: Materials, Properties, and Reliability
King-Ning Tu
Resumen/Descripción – provisto por la editorial
No disponible.
Palabras clave – provistas por la editorial
No disponibles.
Disponibilidad
| Institución detectada | Año de publicación | Navegá | Descargá | Solicitá |
|---|---|---|---|---|
| No detectada | 2007 | SpringerLink |
Información
Tipo de recurso:
libros
ISBN impreso
978-0-387-38890-8
ISBN electrónico
978-0-387-38892-2
Editor responsable
Springer Nature
País de edición
Reino Unido
Fecha de publicación
2007
Información sobre derechos de publicación
© Springer 2007
Cobertura temática
Tabla de contenidos
Ductile–to-Brittle Transition of Solder Joints Affected by Copper–Tin Reaction and Electromigration
King-Ning Tu
Concerning the mechanical properties of solder joints, there are two unique characteristics worth mentioning again and again. The first is that solder alloys have a very high homologous temperature at the device working temperature or at room temperature.
II - Electromigration and Thermomigration | Pp. 305-326
Thermomigration
King-Ning Tu
When an inhomogeneous binary solid solution or alloy is annealed at constant temperature and constant pressure, it will become homogeneous. On the contrary, when a homogeneous binary alloy is annealed at atmospheric pressure but under a temperature gradient, i.e., one end of it is hotter than the other end, the opposite will happen and the alloy will become inhomogeneous.
II - Electromigration and Thermomigration | Pp. 327-346